Horizontal Furnaces

Full Production

Designed for High Performance in Production Environment while stays Efficient and Economic

Features and Benefits

  • Maintenance friendly mechanical design
  • State of the art modular control system, in-house designed and manufactured
  • 10,4“ high-res touchscreen for operator interface
  • Up to 4 stacked quartz or SiC tube reactor chambers for various procesess
  • No thermal interference between different tubes
  • Contactless fully automated boat-in-tube loading both cantilever or softlanding configurations
  • Independent tube level control system
  • HW safety interlocks independent on main CPU
  • HEPA or ULPA filtres installed in load station
  • Boat elevator and wafer handling automation
  • UHP face seal fittings and welds for connections
  • UHP orbital weldings made in 100/10 Cleanroom

Atmospheric Processes

  • Diffusion (drive-in) high temperature procesess
  • Doping from solid, liquid and gaseous dopant sources e.g.: BBr3, B2H6, POCL3, PH3, BN
  • Various thermal processing e.g. annealing, sintering
  • Pyrogenic Wet Oxide with External Burning System
  • Wet Oxide with ultra pure steamer
  • Dry Oxide
  • HiPOx (High Pressure Oxide)


LPCVD Processes

  • Silicon nitride
  • Low temperature oxide (LTO)
  • High temperature oxide (HTO)
  • TEOS oxide
  • Polysilicon, with tilt/flat temperature profile
  • Doped polysilicon
  • Oxynitride


PECVD Processes

  • Silicon nitride (incl. anti-reflective SiN solar cell coating)
  • Silicon oxide
  • Oxinitride

DCE or HCl optional for all processes

Wafer Handling Automation

Partial automation


  • Stand-alone cassette to boat wafer transfer system


Full automation

  • Boat elevator
  • Fully automated stocker with built-in elevator and wafer transfer system

Typical configuration for Boat Elevator is 5 boats each with 50 slots each (200 mm wafers) and 6 boats (150 mm wafers).

In case of stocker, the system includes built-in wafer handling robot and the boat elevator. The stocker is integrated into the horizontal furnace and stores loaded and unloaded cassettes for a smooth continuous and fully automatic furnace operation.

Technical data

Sample dimensions W x D x H (mm) 5600 x 2600 x 1000
Wafer size (mm) 150, 200, 300 or any custom size
 Wafer load 100+
 Heating system  3 or 5 zone
 Flat zone Up to 1067 mm (42″)
 Process temperature 200°C to 1300°C, ± 0.5°C across flat zone
 Power consumption 18kW – 30kW per tube
Power supply
(adapted to power grid of destination country)
150 mm: 3-phase, 400/480VAC, 140A, 50/60 Hz
200 mm: 3-phase, 400/480VAC, 160A, 50/60Hz
Clean dry air 70 – 110 psig (4,8 to 7,6 bar)
 Cooling water 40 – 60 LPM
 Exhaust 210m³/h per tube
 Options Boat elevator and wafer handling automation


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