Compact Tabletop Furnace

Ideally suited for R&D laboratories and pilot production

The SVCS Tabletop Furnace system provides a semiconductor grade quality tool for universities, R&D laboratories and pilot fabs. This system can be used for wide range of processes due to outstanding flexibility and amount of optional modules available to meet special and often unique requirements of every customer.

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Processes

  • Gas, liquid or solid state source diffusion
  • Dry or Wet oxidation + Trans-LC
  • Annealing (forming gas or nitrogen)
  • Sintering
  • Polyimide baking/curing
  • Atmospheric, LPCVD, PECVD
  • Silicon Nitride
  • poly-Si, α-Si
  • TEOS, HTO, LTO
  • Graphene, CNTs, Nanowires

Features

  • Atmospheric or Vacuum design
  • Small footprint
  • Low power consumption
  • Easy operation and maintenance
  • Heating element with 1 or 3 temperature zones, max. temperature up to 1300 oC
  • Modern modular proprietary control system
  • Up to 8 gas lines and 2 liquid sources
  • Independent hardware safety interlocks
  • Integration of vacuum pump systems in cooperation with leading pump manufacturers

Technical Data

 Wafer size  2″ – 6″ (50 mm – 150 mm)
 Wafer load  up to 25 wafers/batch
 Heating system  1 or 3 zone, helical Kanthal® APM/A1 wire
 Flat zone  12″ (300 mm)
 Process temperature  200 oC  –  1300 oC, ± 0.5 oC across flat zone
 Power consumption  20 kVA total
 Power supply  3-phase, 400 or 480VAC, 50 A, 50 or 60 Hz
(system is always adapted to country- specific power supply network)
 Clean dry air  70 – 110 psig (4,8 to 7,6 bar)
 Cooling water  40 – 60 LPM
 Exhaust  210 m³/h
 Options  CEM unit, EBS system, facility equipment

 

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