LPCVD Furnace

for High Process Performance

The design of the SVCS Low Pressure Chemical Vapor Deposition furnaces combines the multiple process capability with the needs of a maximum capacity for full production system (SVcFUR-FP) and high flexibility small scale versions for use in research and pilot production (SVcFUR-RD). It provides an easy-to-maintain, safe and reliable horizontal furnace platform.

The SVCS design is outstanding for high efficiency, minimised footprint and low cost of ownership while offering high process flexibility.

Read more

LPCVD Processes

  • Silicon nitride
  • Low temperature oxide (LTO)
  • High temperature oxide (HTO)
  • TEOS oxide
  • Polysilicon, both with tilt andflat temperature profile
  • Doped polysilicon
  • Oxynitride

Features and Benefits

  • State of the art modular control system; in-house designed, highly tailored and in-house manufactured
  • Top notch components always selected for excellent results and trouble free long life of the furnace equipment
  • Up to 4 stacked quartz  tube reactor chambers for various procesess
  • Multiple methods of vacuum control, heated or unheated
    • Throttling Buttefly Valve – TBV
    • N₂ ballast
    • Vacuum pump control with frequency converter
  • Integration of vacuum pump system in cooperation with leading vacuum pump manufacturers
  • Advanced water cooling tube level system: no thermal interference between different tubes
  • Proprietary designed water cooled flanges
  • Contactless fully automated boat-in-tube loading both cantilever or softloading configurations
  • Maintenance friendly mechanical design

Technical data

Wafer size 150 mm, 200 mm or any custom size
 Wafer load FP: 100+
RD: 25 (typical)
 Heating system  3 or 5 zone
 Flat zone FP: up to 1067 mm (42″)
RD: down to 300 mm (12″)
± 0.5°C across flat zone
 Process temperature 200°C to 1200°C
 Power consumption 80kW – 150kW depending on tube configuration
 Power supply 150 mm: 3-phase, 400 or 480VAC, 140 A, 50 or 60 Hz
200 mm: 3-phase, 400 or 480VAC, 160A, 60Hz
(system is adapted to country- specific power supply network)
Clean dry air 70 – 110 psig (4,8 to 7,6 bar)
 Cooling water 40 – 60 LPM
 Exhaust 210m³/h per tube
 Options Boat elevator and wafer handling automation

 

Contact our local representative for more information

Show global contacts